Dilase

LASER LITHOGRAPHY SYSTEM : DILASE 250

Tabletop system

The laser lithography system Dilase 250 is a versatile and compact equipment gives access to laser lithography to a wide range of new applications such as microfluidicsmicromechanics or photonics. Dilase 250 is especially well suited for fast prototypingphotomask fabrication and microfabricationdirectly on

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PERFORMANCES
  • Linear writing speed  : up to 100mm/s
  • Address grid​ : 100nm
  • Repeatability : 100nm
  • Accepted wafers​ : 1 to 4 inches
  • Accepted substrate thickness: from 250µm to 5mm
  • Laser beam width (1 or 2) : from 1µm to 50µm
  • Aspect ratio : from 10 up to 20
  • Realignment precision : 1µm
SPECIFICATIONS
  • Dimensions : 550 x 670 x 700 mm
  • Available laser sources​ : 375nm or 405nm
  • 1  beam size
  • Video realignment system
  • Accepted files format : DXF, GDSII, LWI
  • Motorized focal length
  • Integrated design software : KloéDesign V.2
  • Three writing modes : vectorial, scanning or a combination of both

HIGH RESOLUTION DIRECT LASER LITHOGRAPHY SYSTEM : DILASE 650

The multifunction laser lithography system

The High resolution direct laser lithography system Dilase 650 offers you the possibility to work with one or two writing lasers, to be focused into one to two beam sizes ranging from 1µm to 50 µm. It allows the writing on any type of substrate (photomasks, semiconductors, glass, polymers, crystals, flexible films…) over a surface area as large as 6 inches.

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PERFORMANCES
  • Linear writing speed : up to 500mm/s
  • Address grid : 100nm
  • Repeatability : 100nm
  • Accepted wafers : 1 to 6 inches
  • Accepted substrate thickness​ : 250µm to 10mm
  • Laser beam width (1 or 2) : from 1µm to 50µm
  • Aspect ratio: minimum 10 up to 40
  • Realignment precision : 500nm
SPECIFICATIONS
  • Dimensions : 1270 x 970 x 1650 mm
  • Available laser sources : 375nm et/ou 405nm
  • 1 or 2 beam sizes
  • Video realignment system
  • Accepted files format  : DXF, GDSII, LWI
  • Motorized focal stage
  • Integrated design software : KloéDesign V.2
  • Three writing modes: vectorial, scanning or a combination of both

CUSTOMISABLE LASER LITHOGRAPHY SYSTEM

Direct laser writing tailored to needs

The customisable laser lithography system Dilase 750 offers you the the possibility to work with one, two or three writing laser sources over one, two or three laser beam widths ranging from 0,5µm to 50µm. It enables the writing on any type of substrate (photomask, semiconductors, glass, polymers, cristal, flexible films…) over a standard working surface of 6″x6″, extendable up to 12″x12″ and even larger on demand.

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PERFORMANCES
  • Linear writing speed : up to 350mm/s
  • Address grid : 40 nm or 100nm
  • Repeatability : 100nm
  • Accepted wafers : from 1 at 12 inches
  • Accepted substrate thickness : from 250µm to 10mm
  • Laser beam width (1 or 3)​ :  from 0,5µm to 100µm
  • Aspect ratio: minimum 10 up to 40
  • Realignment precision : 500nm
SPECIFICATIONS
  • Dimensions : 1801 x 1204 x 1790 mm
  • Available laser sources: 325nm,375 nm,405 nm and 445 nm
  • From 1 to 3 beam size
  • Video realignment system
  • Accepted files format : DXF, GDSII, LWI
  • Motorized focal length
  • Integrated design software : KloéDesign V.2
  • Three writing modes : vectorial, scanning or a combination of both.